It has taken the better part of a year and a half and some wrangling with the US Department of Justice to get it done, but ...

Micron Technology has not just filled in a capacity shortfall for more high bandwidth stacked DRAM to feed GPU and XPU ...

As we have said many times here at The Next Platform, the only way to predict the actual future is to live it. Despite that, ...

The biggest challenge to AI initiatives is the data they rely on. More powerful computing and higher-capacity storage at ...

There is not one Ethernet business, but several, and now, with the evolution of Ethernet switches for back-end AI cluster ...

Right or wrong, we still believe that we live in a world where traditional HPC simulation and modeling at high precision ...

There are two types of packaging that represent the future of computing, and both will have validity in certain domains: Wafer scale integration and multichip module packaging. While we love the idea ...

If the datacenter had been taken over by InfiniBand, as was originally intended back in the late 1990s, then PCI-Express peripheral buses and certainly PCI-Express switching – and maybe even Ethernet ...

We don’t think the uplift can be much more than around 25 percent because the memory upgrade to HBM3 and then HBM3E would push the memory price to be larger than the rumored prices of Nvidia GPUs on ...

It seems like we have been talking about Google’s TPUv4 machine learning accelerators for a long time, and that is because we have been. And today, at the Google Cloud Next 2022 conference, the search ...