SUNNYVALE, CA – Synopsys has officially completed its acquisition of Ansys, finalizing a deal first announced in January of last year. The move combines Synopsys’ strengths in silicon design and IP ...

A step-down PCB is simply a multilayer PCB whose board thickness is reduced (stepped down) in a few places. The step-down is ...

SANTA ANA, CA – TTM Technologies has announced the acquisition of a 750,000 sq. ft. facility in Eau Claire, WI, and land rights for a new manufacturing site in Penang, Malaysia.

WASHINGTON – Global semiconductor sales reached $59 billion in May, a 27% year-over-year increase, according to data released today by the Semiconductor Industry Association (SIA). Sales were up 3.5% ...

Austin, Texas – High Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member. “Lincstech has been supporting the electronics industry with ...

Cloud-based collaboration prevents costly errors in PCB design by improving version control, team efficiency, and real-time data access across remote teams.

Rebuilding the industrial base will take time and commitment. There has been a lot of talk, chatter, posturing and proclamations by pundits and politicians alike about the soon-to-be American ...

Analog design remains critical in a digital world, demanding precise placement, shielding, and memory tuning for performance in modern RF, IoT, and DDR applications.

Are you consistently solving problems and adding value? For an organization to improve, its culture must embrace change. Determining and measuring organizational culture presents challenges since it ...

Recouping value from excess stock. If manufacturers understood the true value and opportunity of their excess and obsolete (E&O) electronic component stock, they would take a much more proactive ...

Progress for glass-core substrates and RDL interposers highlighted ECTC’s 75th anniversary conference. More than 2,500 attendees braved the stormy Texas weather to discuss the latest developments in ...

Software-defined tools and virtualization are key to scaling networks for 5G, 6G, and future latency-critical applications like AR, autonomous vehicles, and smart factories.